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The purpose of this paper is to give a comprehensive solution method for the manipulation of parts with complex geometries arriving in bulk into a robotic assembly cell. As bin-picking applications are still not reliable in intricate workcells, first, the problem is transformed to a semi-structured pick-and-place application, then by collecting and organizing the required process planning steps, a methodology is formed to achieve reliable factory applications even in crowded assembly cell environments.

The process planning steps are separated into offline precomputation and online planning. The offline phase focuses on preparing the operation and reducing the online computational burdens. During the online phase, the parts laying in a semi-structured arrangement are first recognized and localized based on their stable equilibrium using two-dimensional vision. Then, the picking sequence and corresponding collision-free robot trajectories are planned and optimized.

The proposed method was evaluated in a geometrically complex experimental workcell, where it ensured precise, collision-free operation. Moreover, the applied planning processes could significantly reduce the execution time compared to heuristic approaches.

The methodology can be further generalized by considering multiple part types and grasping modes. Additionally, the automation of grasp planning and the enhancement of part localization, sequence planning and path smoothing with more advanced solutions are further research directions.

The paper proposes a novel methodology that combines geometrical computations, image processing and combinatorial optimization, adapted to the requirements of flexible pick-and-place applications. The methodology covers each required planning step to reach reliable and more efficient operation.

The purpose of this paper is to present a novel approach on investigating critical current densities in the solder joints of chip-size surface mounted device (SMD) components. The investigation involves a numerical approach and a physical validation with selected track-to-pad connections and high current loads (CXs).

During the investigations, shape of solder fillets was calculated in Surface Evolver, and then the current densities were calculated accordingly in the given geometry. For the verification, CX tests were performed on joints at elevated temperatures. The joints were qualified with X-ray microscopy, cross-section analysis and shear tests.

This study ascertained that the inhomogeneity in current density depends on the track-to-pad structure of the joint. Also this study found that the heavy CX decreases the mechanical strength, but the degradation does not reach the level of electromigration (EM)-induced voiding.

The heavy CX significantly affects joint reliability and the results point out to EM-induced failure-limitations on printed circuit board (PCB)-based assemblies due to the thermomechanical weakness of the FR4 material.

The experiments investigate current density from a novel aspect on more frequently used small-scale components with different track-to-pad configurations – pointing out possible failure sources.

The chapter depicts the potential place of the spirit of non-violence and the spirit of peace in social affairs and economic circumstances. It deals with the approach of Mahatma Gandhi to non-violence and the approach of Saint Francis of Assisi to noble poverty, simplicity and peace as one of the great inspirations to Gandhi. These two concepts are closely interrelated, as they have analogous aspects in theory and practice. Both of them seem suitable to be used as the main characteristics of dealing with social and ecological problems.

The following part of the chapter describes the life and the credo of Mahatma Gandhi, emphasizing the importance of non-violence, an alternative approach to deal with emerging social difficulties. After it, the chapter presents the life and the philosophy of Saint Francis of Assisi and how Gandhi was inspired by him. It emphasizes the importance of peace, noble poverty, simplicity and their spirit in ecological and social affairs. The chapter then presents non-violence and poverty as spiritual notions and shows intermediary concepts and examples of feasible business models by which they could be applied in economic practices. Non-violence and peace can be the spirit of business strategies, and they have the potential to transform modern economic practices into a more humanistic and sustainable form.

The purpose of this paper is to present a novel and alternative method for the characterization of isotropic conductive adhesive (ICA) joints’ conductivity by the calculation of the mean intercept length of conductive flakes in the cured joint. ICAs are widely used in the field of hybrid electronics or special printed circuit board applications, such as temperature sensitive or flexible circuits. The main quality parameters of the ICA joints are the conductivity and the mechanical strength.

For the experiments, one-component Ag-filled thermoset ICA paste was used on FR4 printed circuit test board to join zero-ohm resistors. Six different curing temperatures were applied: 120, 150, 175, 210, 230 and 250°C. The conductivity of the joints was measured in situ during the curing process. Micrographs were taken from the cross-sectioned joints, and the mean intercept length was calculated on them after image processing steps.

Results of the measured conductivity and the mean intercept length were compared, and acceptable correlation was found for what can be used for characterizing the conductibility of ICA joints.

Investigating and characterizing the conductivity of ICA joints by an image processing method.

The main advantage of this method compared to the electrical measurements is that the conductivity characterization is possible on any kind of component. Therefore, this method can be used in any appliances not only in test circuits.

This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD) components and ball grid array (BGA) lead-free solder joints with the focus of via-in-pad geometries. The investigation involves a numerical approach and a physical validation with selected geometry configurations and high current loads to reveal possible failure sources. The work is a continuation of a previous study.

Current density was investigated using finite element modeling on BGA joints. Dummy BGA components, 0402 and 0603 zero ohm jumper resistors, were used, both in daisy chain setups on standard FR4 printed circuit boards (PCBs). Respective physical loading experiments were set to find effects of elevated current density at hot zones of the joints. Cross-section analysis, scanning electron microscopy and shear force tests were used to analyze the joints.

The findings reveal alterations in the joints, while the current loading is not directly affecting the structure. The modeling reveals the current density map in the selected formations with increased current crowding zones. Overall, the degradation does not reach the level of electromigration (EM)-induced voiding due to the limiting factor of the FR4 substrate.

The heavy current load affects joint reliability, but there are limitations of EM-induced failures on PCB-based assemblies due to the thermomechanical weakness of the FR4 material.

The experiments investigate current density from a novel aspect on frequently used BGA surface mounted components with modeling configurations focusing on possible effects of via-in-pad structure.

This chapter summarizes the library history of Hungary, with the main focus on the decades preceding the regime change in 1989. The country has been a member of the European Union since 2004. One of the consequences of joining the EU was that Hungary had to implement the three-tier system of higher education defined by the Bologna Declaration. This new system of library and information professional education and training that began in the 2006–2007 academic year is discussed in detail. The first students to begin their studies in the new, two-tier system of higher education will be awarded the BA degree in the first half of 2009. The best of them will be able to continue their studies at the MA level at one of the four universities that were approved for new MA programs in 2008.

The authors of this chapter focus on the development of comparative education in 10 countries of Eastern and Central Europe. A historical approach is applied to the study of the main characteristics of comparative education. The first part of the chapter is devoted to the origin of comparative education studies in this region from the fifteenth to seventeenth centuries till the end of the nineteenth century. The second part of the chapter examines the process of establishment of comparative education as a science and the appearance of the first lecture courses on comparative education in some countries of this region from the beginning of the twentieth century till the end of World War II. The third part presents the state of comparative education during the years of socialism – from the end of World War II to the fall of the Berlin Wall. The fourth part surveys the modern development of comparative education in Eastern and Central Europe from the beginning of democratic changes in 1989 to the present day. While presenting comparative education in each historical period, the authors first show the most prominent comparativists, then emphasize on comparative education as a university discipline, and finally synthesize the main characteristics of the development of comparative education during the period of view. The chapter concludes with some generalizations on the four periods.